Ball Bonding Crossword Puzzle

Download and print this Ball Bonding crossword puzzle. Use a pencil or pen to complete the puzzle by filling in the blanks. The completed answers are included, so you can easily check your progress.

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Thermosonic : The ____ method of bonding results from five variables (Force, Ultrasonic Energy, Stage Temperature, Time, and Ball Size
Ultrasonic Energy : Scrubbing that ensures metal-to-metal contact is called what?
Stage Temperature : What is provided to vaporize moisture?
Nitrogen : Bonded units when not in use are stored in a dry box purged with what?
Crescent : What is bond 2 of 2 called?
Lowest : The work stage must be set up from what bond point?
One hundred forty : The heat stage must hit this temperature in degrees before bonding the unit.
Destructive : Before bonding the machine must be certified with a coupon and what type of testing on 10 bonds
Gloves : When bonding is complete, remove the assembly from the heat stage using what?
Force : If ____ is too low the bond will not stick and if it is too high, over-bonding can occur
Time : If ____ is too short the bond will not stick or over-bonding can occur
Ultrasonic : If ______ is too high, over-bonding can occur
Circuitry : The ball or wire must not make contact with any uncommon what?
Stress Relief : After bonding, the wire must have what?
Eight : Per MCS F-785 all material to be bonded must be plasma cleaned every _____ hours.

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QUESTIONS LIST:

thermosonic : the _ method of bonding results from five variables (force, ultrasonic energy, stage temperature, time, and ball size
ultrasonic energy : scrubbing that ensures metal-to-metal contact is called what?
stage temperature : what is provided to vaporize moisture?
nitrogen : bonded units when not in use are stored in a dry box purged with what?
crescent : what is bond 2 of 2 called?
lowest : the work stage must be set up from what bond point?
one hundred forty : the heat stage must hit this temperature in degrees before bonding the unit.
destructive : before bonding the machine must be certified with a coupon and what type of testing on 10 bonds
gloves : when bonding is complete, remove the assembly from the heat stage using what?
force : if _ is too low the bond will not stick and if it is too high, over-bonding can occur
time : if _ is too short the bond will not stick or over-bonding can occur
ultrasonic : if _ is too high, over-bonding can occur
circuitry : the ball or wire must not make contact with any uncommon what?
stress relief : after bonding, the wire must have what?
eight : per mcs f-785 all material to be bonded must be plasma cleaned every _ hours.